Wafer Packing
We are leaders in the development and manufacture of wafer handling and inspection equipment. Our technological expertise in the wafer handling process (wafer packing, ultra thin wafer handling) make our systems extremely safe and secure. Our industrial vision specialists have developed advanced systems for automatic inspection of peripheral breakages, back-side silicon micro cracks, cosmetics, as well as wafer geometry (thickness, bow, warp). In addition, our systems are compliant with the SEMI* standard required by the semiconductor industry.
Please Contact Kurt Kaashoek for Wafer Packing information & Sales
kkaashoek@nbstech.com
1-480-459-5600
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Wafer Packing |
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Wafer Backside Inspection |
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| 300 mm automated wafer packing/unpacking /sorting WPC™ EVO |
200 mm Collective wafer packing WPC™ 200 Advance |
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Advanced wafer backside inspection WBI™ 200 |
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