Wafer Packing & Handling Solutions

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WPC™ EVO

300mm automated wafer

 

WPC 300 - 300 mm wafer packing machine

Contact us for complete
technical specifications
for WPC EVO

 

All specifications are subject to change

without notice.

 

The semiconductor industry manufactures silicon wafers that need to be sorted, documented and packed (or unpacked) for shipment to different manufacturing facilities - front-end, back-end, or external customers. The WPC EVO provides the lowest cost of ownership process for automatically sorting, packing and unpacking silicon wafers, without damage, with complete traceability.

 

WPC EVO quickly and safely sorts and transfers 200mm and/or 300 mm silicon silicon wafers between a variety of industry standard cassettes and “coin stack” horizontal silicon wafer shippers. The WPC EVO automatically manages every step of the packing process including verification of each silicon wafer handled and manipulation of all silicon wafer packing
materials. The WPC EVO is the smallest, safest, fastest and most reliable solution for your automated silicon wafer storage and shipment needs.

 

If your requirement is for 200mm silicon wafer handling, see our WPC 200 Advance . Also, see our silicon wafer backside inspection equipment for 200mm wafers.

WPC is a trademark of NBS Technologies Inc.

Contact Us for information on all of our Smart Card Manufacturing & Wafer Handling/Packing Solutions today.

 

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ZXP Series 8™

Re-Transfer Printer

For dual or single-sided
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For 200mm silicon wafer handling & packaging
equipment see below:

WPC 200 Advance - 200mm wafer packing equipment

WBI™ 200

For the back side inspection of
200 mm silicon wafers

WBI 200 - wafer backside inspection machine

WPC™ 200 Advance

Safely packs 200 mm silicon wafers into horizontal silicon wafer shippers


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