Wafer Packing & Handling Solutions
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WBI™ 200
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Contact us for complete
All specifications are subject to change without notice. |
The semiconductor industry manufactures ICs on silcon wafers which are now being backlapped down to 180µm (200 mm wafers) in thickness or less.
Let the experts at NBS show you how you can protect your investment with our wafer backside inspection machine. Also consider our wafer handling offers for either 200mm or 300mm wafers. |
WBI is a trademark of NBS Technologies Inc. |
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Contact Us for information on all of our Smart Card Manufacturing & Wafer Handling/Packing Solutions today. |
NOW with Laminator! 
For dual or single-sided
high-quality photo printing
Click here to view all of our newest solutions.
Other 200mm silicon wafer
products inlcude:

Safely packs 200 mm silicon wafers into horizontal silicon wafer shippers
For 300mm silicon wafer handling & packaging equipment see below:

Safely sorts and transfers
200mm and/or 300 mm silicon wafers between a variety of industry standard cassettes and “coin stack” horizontal silicon wafer shippers
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