WBI 200 - 200mm Wafer Handling for the semiconductor industry

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WBI™ 200
Advanced Wafer Backside Inspection

WBI 200 - wafer backside inspection machine

Contact us for complete
technical specifications
for the WBI 200

All specifications are subject to change

without notice.

The semiconductor industry manufactures ICs on silcon wafers which are now being backlapped down to 180µm (200 mm wafers) in thickness or less.

Manufacturing defects can appear on the backside or edge of silicon wafers that could later induce breakage during assembly operations. For example, problems may occur when residue particles remaining from the grinding operation provoke a micro-crack, or star, when silicon wafers are held on chucks.

Let the experts at NBS show you how you can protect your investment with our wafer backside inspection machine. Also consider our wafer handling offers for either 200mm or 300mm wafers.

WBI is a trademark of NBS Technologies Inc.

Contact Us for information on all of our Smart Card Manufacturing & Wafer Handling/Packing Solutions today.

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Other 200mm silicon wafer
products inlcude:
WPC 200 Advance - 200mm wafer packing equipment

WPC™ 200 Advance

Safely packs 200 mm silicon wafers into horizontal silicon wafer shippers

For 300mm silicon wafer handling & packaging equipment see below:

WPC 300 - 300 mm wafer packing machine

Safely sorts and transfers
200mm and/or 300 mm silicon wafers between a variety of industry standard cassettes and “coin stack” horizontal silicon wafer shippers

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