WBI 200 - Wafer Handling

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WBI 200

WBI 200 - wafer backside inspection machine

Advanced wafer backside inspection

The semiconductor industry manufactures ICs on wafers which are now being backlapped down to 180µm (200 mm wafers) in thickness or less.

Manufacturing defects can appear on the backside or edge of wafers that could later induce breakage during assembly operations. For example, problems may occur when residue particles remaining from the grinding operation provoke a micro-crack, or star, when wafers are held on chucks.

Let the experts at NBS show you how you can protect your investment with our wafer backside inspection machine. Also consider our wafer handling offers for either 200mm or 300mm wafers.

	Contact Us or your local Authorized NBS Dealer today and find the NBS products and services that can add value to your business.

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