We are leaders in the development and manufacture of wafer handling and inspection equipment. Our technological expertise in the wafer handling process (wafer packing, ultra thin wafer handling) make our systems extremely safe and secure. Our industrial vision specialists have developed advanced systems for automatic inspection of peripheral breakages, back-side silicon micro cracks, cosmetics, as well as wafer geometry (thickness, bow, warp). In addition, our systems are compliant with the SEMI* standard required by the semiconductor industry.

Wafer Handling/Packing			Wafer Back Side Inspection
WPC EVO 300 mm automated wafer packing/unpacking/sorting equipment	WPC 300 Collective 300 mm wafer packing equipment	WPC 200 Advance Collective 200 mm wafer packing equipment	WBI 200 Advanced wafer backside inspection

 

 

Contact Us or your local Authorized NBS Dealer today and find the NBS products and services that can add value to your business.

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