Wafer Packing & Handling Solutions

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Wafer Packing / Handling Overview

 

We are leaders in the development and manufacture of wafer handling and inspection equipment. Our technological expertise in the wafer handling process (wafer packing, ultra thin wafer handling) make our systems extremely safe and secure. Our industrial vision specialists have developed advanced systems for automatic inspection of peripheral breakages, back-side silicon micro cracks, cosmetics, as well as wafer geometry (thickness, bow, warp). In addition, our systems are compliant with the SEMI* standard required by the semiconductor industry.

 

 

Wafer Handling/Packing
Wafer Back Side Inspection
WPC EVO
WPC300
WBI200

WPC™ EVO
300 mm automated wafer packing/unpacking/sorting equipment

WPC 200 Advance
Collective 200 mm wafer packing equipment
WBI™ 200
Advanced wafer backside inspection

 

WPC and WBI are trademarks of NBS Technologies Inc.

 

Contact Us for information on all of our Smart Card Manufacturing & Wafer Handling/Packing Solutions today.

 

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