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Home > Products > Smart Card Manufacturing Equipment > Card Testing

BTM
Micro Module Tension and Compression
Test Bench

BTM - Micro module Tension & Compression Test Bench

Contact us for complete
technical specifications
for BTM

BTM is a test bench designed for post production quality testing of smart cards.

Mechanical stress is applied on the micromodule to characterize the quality of insertion by measuring the traction and compression force and is part of the NBS central issuance solution where smart card manufacturing capabilities are required.

Features:

  • 5000 / 10000 / 15000 micromodules / hour
  • Stand alone or inline use
  • Visualisation of glue tape centering
All specifications are subject to change without notice.  

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